Rework Service Product List and Ranking from 4 Manufacturers, Suppliers and Companies

BGA Rework and Reballing Support [Case Study Introduction]

Support for BGA rework and reballing that cannot afford to fail.

At Kei All, we accept BGA rework even for boards that are not implemented in our own line. If it is at an early stage of the process, rework may be easily performed. We often receive requests for difficult BGA rework and reballing from other assembly companies in the industry. We support "BGA rework and reballing work that cannot afford to fail," especially for high-cost and hard-to-obtain devices. [Features] - Support for device rework - BGA rework compatible For more details, please contact us or download the catalog.

Company：ケイ・オール
Price：Other

Other contract services

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Removal/Installation of BGA Components

Using dedicated rework equipment! We can flexibly accommodate packages with strict conditions.

We would like to introduce the "Removal/Installation of BGA Components" conducted by Ruiling Electric Co., Ltd. In recent years, BGA (Ball Grid Array) components for memory and ASICs have become mainstream, and it is very difficult to remove/install these components with conventional tools. Our company uses dedicated rework equipment and manages temperature through temperature profiles, allowing us to flexibly handle not only standard BGAs but also packages with strict conditions, such as POP. Additionally, by using rework equipment, we have improved the reliability of the removal/installation of these components. 【Features】 ■ Use of dedicated rework equipment ■ Flexible response to packages with strict conditions ■ Improved reliability of removal/installation of these components through the use of rework equipment *For more details, please refer to the PDF document or feel free to contact us.

Company：瑞菱電機ずいりょうでんき
Price：Other

Other contract services

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Rework Service <EMS Solution>

We also offer "Rework Technical Consulting," where we dispatch experienced engineers from our company!

At Higashi Electronic Industry Co., Ltd., we accept rework of various types of mounted components (SMD, IMD), including BGA (Ball Grid Array). By performing BGA reballing, it is possible to reuse components (reinstallation on different boards due to component depletion, failure analysis of individual components, failure analysis and reproducibility confirmation through component swap reinstallation, etc.). We can also handle the removal (live capture) of components other than BGA that you wish to reuse, as well as modifications to the circuit board. 【Supported Patterns】 ■1. New component rework ■2. New component post-installation ■3. Removal (live capture) ■4. Component regeneration/reinstallation ■5. Component regeneration only *For more details, please refer to the related links or feel free to contact us.

Company：ヒガシ電子工業
Price：Other

Other electronic parts

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EMS Solution Rework Service

For those who have no rework experience or have rework equipment but are unable to use it effectively!

We perform rework on various types of mounted components (SMD, IMD). We offer five patterns of service: "new component rework," "new component addition," "removal (live capture)," "component regeneration/re-implementation," and "component regeneration only." Additionally, we possess rework equipment from reliable domestic manufacturers, allowing us to measure and provide temperature profiles as needed. 【Rework Lineup for Mounted Components (partial)】 ■BGA ■QFP ■SOP ■PLCC ■HTD *For more details, please download the PDF or feel free to contact us.

Company：ヒガシ電子工業
Price：Other

Circuit board design and manufacturing

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BGA/CSP implementation and rework work Rework service

Implementation and rework of BGA and CSP, solving everything from defect detection to implementation and inspection with specialized equipment and the skills we have developed over time!

At Shimizu Electric, we specialize in the assembly and rework of BGA and CSP. We are ready to assist our customers with everything from defect detection to assembly and inspection, using specialized equipment and the skills we have developed over the years. 【What can be done in rework operations】 1. Detection of soldering defects in BGA and CSP 2. Removal of BGA and CSP (BGA and CSP rework equipment) 3. BGA and CSP reballing (BGA and CSP reballing) 4. Assembly of BGA and CSP (BGA and CSP rework equipment) 5. Soldering of BGA and CSP (BGA and CSP rework equipment, N2-compatible reflow equipment) 6. X-ray inspection of BGA and CSP (X-ray inspection equipment)

Company：フカサワ本社工場　長泉ファクトリー
Price：Less than 10,000 yen

Contract manufacturing
Processing Contract
Other contract services

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